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HAS530M12BM3

Product shot of Wolfspeed's HAS BM3 Half-bridge SiC power module package
HAS530M12BM3
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1200 V, 2.67 mΩ, 62 mm, Half-Bridge, Industrial + HV-H3TRB qualified, CTI 600, SiC Power Module
Designed for Harsh Environments. Wolfspeed’s BM3 power module platform provides the system benefits of silicon carbide (SiC) while maintaining the robust, industry-standard 62 mm module package. The internal design of Wolfspeed’s 62 mm BM3 package enables high speed silicon carbide switching benefits and increased system efficiency, due to the low-inductance layout. The BM3 platform is a perfect fit for high frequency industrial outdoor applications such as rail, EV charging infrastructures and so on.

Products

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62 mm BM3 Silicon Carbide Half-Bridge Power Modules

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62 mm BM3 Silicon Carbide Half-Bridge Power Modules

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Data Sheet
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Configuration
Blocking Voltage
Current Rating
RDS(ON) at 25°C
Generation
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HAS530M12BM3
Coming
Soon
62 mm
Half-Bridge
1200 V
530 A
2.67 mΩ
Gen 3 MOS + Diodes
150 °C
105 x 62 x 31 mm
Active
Industrial + HV-H3TRB

Product Details

Features
  • Industry-Leading
  • Reliable silicon carbide MOSFET Technology in Robust
  • Well-Established 62mm Form Factor
  • Strong Thermal Performance + Material Selections Optimized for Industrial & Harsh Environment Applications
  • Low-Inductance Design (10 – 15 nH) for Fast Switching with Low Power Losses
  • MOSFET Die and Selected Modules Qualified to HV-H3TRB
  • CTI 600
Benefits
  • Broad Portfolio of Current and Voltage Ratings Available to Fit Diverse Industrial Application Requirements
  • Fast Time to Market with Minimal Development Required for Transition from 62 mm IGBT Packages
  • Reduced Cooling Requirements & Overall System Cost
  • Optimized Internal Layout for Low Power Losses & Minimal Overshoot for Maximum Voltage Utilization
Applications
  • Induction Heating
  • Motor Drives
  • Energy Generation / Smart Grids / Smart Energy
  • Railway
  • EV Fast Charging
  • UPS and SMPS

Documents, Tools & Support

Display All SKUs in Product Family (15)

Documents

Document Type
Document Name
Last Updated
Data Sheets
05/2024
User Guide
01/2024
User Guide
01/2024
User Guide
12/2023
User Guide
12/2023
Application Notes
03/2024
Application Notes
01/2024
Application Notes
11/2023
Application Notes
08/2023
Application Notes
01/2023
Application Notes
09/2022
Application Notes
11/2021
Product Catalog
05/2024
Sales Sheets & Flyers
01/2024
Sales Sheets & Flyers
01/2024
Sales Sheets & Flyers
02/2023
Sales Terms
This document details the production packaging details including container type, quantity, MOQ, and dimensions as well as the moisture sensitivity level (MSL) for discrete SiC Schottky Diodes and MOSFETs
04/2024
Sales Terms
12/2021
Technical SupportPower Applications Forum
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