Designing with Top Side Cooled (TSC) Silicon Carbide Power Devices
Improve thermal management and conserve power with Wolfspeed’s New TSC MOSFETs and Schottky diodes.
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Industrial E-Mobility
In The Studio: Driving the Future of E-Mobility
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From energy capture, to energy storage and distribution, the e-mobility movement is encompassing a complete ecosystem of solutions for every driver and vehicle. Join Guy Moxey and Naser Abu Daqqa, Managing Director at Power I.D., to learn how Silicon Carbide is driving the e-mobility movement from sun to wheels.
In The Studio: Driving the Future of E-Mobility
From energy capture, to energy storage and distribution, the e-mobility movement is encompassing a complete ecosystem of solutions for every driver and vehicle. Join Guy Moxey and Naser Abu Daqqa, Managing Director at Power I.D., to learn how Silicon Carbide is driving the e-mobility movement from sun to wheels.
About In The Studio
In The Studio is an in-depth series unpacking some of the semiconductor industry’s biggest questions, and investigating the trends and innovations that are shaping the future of Silicon Carbide and wide bandgap technologies. Each episode features an unscripted sit-down tech talk with industry experts to discuss theories and emerging concepts that look beyond the day-to-day challenges. In The Studio is hosted by Wolfspeed’s Guy Moxey, who has spent nearly three decades helping customers develop ground-breaking applications with the power of Silicon Carbide. Explore our growing video library, and learn more about how you can harness the power of Silicon Carbide.
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Wolfspeed WolfPACK™ Power Module Press-In Process
In this video, we’ll walk you through the press-in and press-out process for Wolfspeed WolfPACK™ silicon carbide power modules, which are available with and without pre-applied thermal interface material (TIM).
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Benefits of Designing with Wolfspeed Silicon Carbide in Low Voltage Motor Drives
Wolfspeed evaluates SiC in industrial low voltage motor drives at three different power levels to evaluate efficiency improvements, and compares improvements realized when smaller heat sinks are combined with SiC.
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