SpeedVal™ Kit Modular Evaluation Platform​ Power Daughter Cards – TO-247-3

Silicon Carbide MOSFETs in a TO-247-3 package can provide a highly compatible footprint for existing designs while supporting high power levels and flexibility in system design and heatsinking. The SpeedVal Kit TO-247-3 power daughter cards feature two MOSFETs arranged in a half-bridge configuration. The unique card edge interface provides low inductance while greatly simplifying the process of swapping out components, enabling high-quality measurements and quick comparisons between different devices. Power Daughter Cards are optimized for making accurate high-bandwidth current and voltage measurements. ​ An on-board current shunt can be optimized for highly accurate dynamic switching tests, or high-power thermal testing. The coaxial MMCX connectors for VGS and IDS and BNC connectors for VDS provide noise-free measurements to improve accuracy and simplify gate drive optimization. The power daughter cards include a pre-assembled heatsink which aligns with a fan on the motherboard to enable high-power testing.