Benefits
- Enables 2 level operation with 1500 VDC link
- System scalability and reliability
- Reduced system complexity
- Ease of layout and assembly
2300 V, 5 mΩ, GM package, Half-Bridge (AlN substrate) SiC Power Module with Pre-Applied Thermal Interface Material (TIM)
2300 V, 5 mΩ, GM package, Half-Bridge (AlN substrate) SiC Power Module with Pre-Applied Thermal Interface Material (TIM)
2300 V, 5 mΩ, GM package, Half-Bridge (AlN substrate) SiC Power Module with Pre-Applied Thermal Interface Material (TIM)