Features
- High Temperature (175 °C) Operation
- Low Inductance (6.7 nH) Design
- Utilizes Latest 3rd Generation Silicon Carbide MOSFETS
- Integrated Temperature Sensor and Kelvin-Drain Connection
- Silicon Nitride Ceramic Substrate and Copper Baseplate
Part Number | EAB450M12XM3 |
---|---|
Order Status | Active |
Buy Online | |
Package | XM |
Container Type | Unit Box |
Container Qty. | 1 |
Standard Packing Qty. | 1 |
Minimum Order Qty. | 1 |
RoHS Declaration | |
---|---|
REACH Declaration | |
California Prop 65 | Learn More |
ECCN | EAR99 |
Document Type | Document Name | Last Updated |
---|---|---|
Data Sheets | 06/2024 | |
User Guide | 01/2025 | |
User Guide | 10/2024 | |
User Guide | 01/2024 | |
User Guide | 01/2024 | |
User Guide | 12/2023 | |
User Guide | 10/2023 | |
User Guide | 09/2023 | |
Application Notes | 01/2025 | |
Application Notes | 01/2025 | |
Application Notes | 01/2025 | |
Application Notes | 07/2024 | |
Application Notes | 07/2024 | |
Application Notes | 03/2024 | |
Application Notes | 01/2024 | |
Application Notes | 11/2023 | |
Application Notes | 08/2023 | |
Application Notes | 01/2023 | |
White Papers | 11/2024 | |
Articles and Papers | 12/2022 | |
Product Catalog | 01/2025 | |
Sales Sheets & Flyers | 01/2024 | |
Sales Sheets & Flyers | 01/2024 | |
Sales Sheets & Flyers | 06/2022 | |
Sales Sheets & Flyers | 04/2022 | |
Sales Sheets & Flyers | 03/2022 | |
Sales Terms | Power Product Packing & Shipping Reference Guide This document details the production packaging details including container type, quantity, MOQ, and dimensions as well as the moisture sensitivity level (MSL) for discrete SiC Schottky Diodes and MOSFETs
| 04/2024 |
Sales Terms | 12/2021 |