Delivering Breakthrough Performance at Real-World Conditions | Daniel Hofmann | 10:00 AM - 10:20 AM (GMT+1) | Stage: E-Mobility, Hall 6 at Booth 6-220 | E-Mobility | Presentation |
Conducted EMI Mitigation of SiC Based Three-Phase Three-Level T-Type Neutral Point Clamped Inverter | Sidharth Gupta, Frank (Chen) Wei | 12:45 PM - 2:15 PM (GMT+1) | Stage: Athens, Hall 10.1 | High Frequency Applications and EMI | Poster |
New 2.3 kV High-Current All-Silicon Carbide Module for Medium Voltage Power Conversion Applications | Ashish Kumar | 12:45 PM - 2:15 PM (GMT+1) | Stage: Athens, Hall 10.1 | SiC Devices | Poster |
Using SiC MOSFETs with Embedded PCB Packaging for Automotive Powertrain Applications | Lauren Lyons, Kevin Lenz | 3:30 PM - 5:00 PM (GMT+1) | Stage: Athens, Foyer | SiC Application and Modelling | Poster |
Partial Turn-On in SiC MOSFETs: Experimental Analysis on Switching Dynamics and Converter Efficiency | Urvi Ahluwalia, Adam Anders | 3:30 PM - 5:00 PM (GMT+1) | Stage: Athens, Foyer | SiC Application and Modelling | Poster |
Busbar Laser Welding for SiC-Optimized Power Systems | Laith Abdul, Leonardo Montoya | 3:30 PM - 5:00 PM (GMT+1) | Stage: Athens, Foyer | Packaging Integration Technologies | Poster |